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Ursprungligen inskrivet av
zillio
Händer det att jag postar PRECIS samma länkar som dig? xD
Hah!

Antagligen för att det var de mest trovärdiga/professionella på första googlingen.
Skulle ta lite mer tid att hitta faktiska vetenskapliga artiklar, ska kolla om det finns några.
http://www.sciencedirect.com/science...69702105709354 säger följande: "... In addition, device lifetime can be decreased drastically because of large thermal stresses that occur especially at interfaces. ..."
http://www.springerlink.com/content/xc5lngakbr4qhdcf/ : "... high power dissipation leads to thermal issues like device degradation and reduced chip lifetime. ..."
http://www.google.se/patents/US62192...ntsec=abstract : "... Increased temperatures can potentiall damage the components of the equipment, or reduce the lifetime of the indicidual components and the equipment. Generally the performance of these components go down with the increase in temperature. Therefore, large amounts of heat produced by many such integrated circuits must be dissipated..."
http://rsim.cs.illinois.edu/Pubs/srinivasan_isca04.pdf : "Ensuring long processor lifetimes by limiting failures due to wear-out related hard errors is a critical requirement for all microprocessor manufacturers. We observe that continuous device scaling and increasing temperatures are making lifetime reliability targets even harder to meet. ..."
" ... After manufacturing, using a technique called burn-in [16], the processors are tested at elevated operating temperatures and voltages in order to accelerate the manifestation of extrinsic failures. ..."